Part Number Hot Search : 
SMS45 1H223J SPRI1205 300SB 390FK011 74VCX16 2SK3080 STCF04
Product Description
Full Text Search
 

To Download ZXMP2120E5 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 ZXMP2120E5
200V P-CHANNEL ENHANCEMENT MODE MOSFET
SUMMARY V(BR)DSS =-200V; RDS(ON) = 28 ; ID = -122mA DESCRIPTION This 200V enhancement mode P-channel MOSFET provides users with a competitive specification offering efficient power handling capability, high impedance and is free from thermal runaway and thermally induced secondary breakdown. Applications benefiting from this device include a variety of Telecom and general high voltage circuits. A 4 pin SOT223 version is also available (ZXMP2120G4). FEATURES
SOT23-5
* High voltage * Low on-resistance * Fast switching speed * Low gate drive * Low threshold * SOT23-5 package variant engineered to increase spacing between
high voltage pins.
APPLICATIONS
* Active clamping of primary side MOSFETs in 48 volt DC-DC converters
ORDERING INFORMATION
DEVICE ZXMP2120E5TA REEL SIZE (inches) 7 TAPE WIDTH (mm) 8mm embossed QUANTITY PER REEL 3,000 units
N/C D N/C
S
DEVICE MARKING
G
* P120
PINOUT - TOP VIEW
ISSUE 2 - SEPTEMBER 2006 1
ZXMP2120E5
ABSOLUTE MAXIMUM RATINGS
PARAMETER Drain-Source Voltage Gate Source Voltage SYMBOL V DSS V GS LIMIT -200 20 -122 -0.7 -0.7 0.75 6 T j :T stg -55 to +150 UNIT V V mA A A W mW/C C
Continuous Drain Current (V GS =10V; T amb =25C) (a) I D I DM Pulsed Drain Current (c) Pulsed Source Current (Body Diode) (c) Power Dissipation at T amb =25C Linear Derating Factor
(a)
I SM PD
Operating and Storage Temperature Range
THERMAL RESISTANCE
PARAMETER Junction to Ambient (a) SYMBOL R JA VALUE 167 UNIT C/W
NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 5 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
ISSUE 2 - SEPTEMBER 2006 2
ZXMP2120E5
ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated)
PARAMETER STATIC Drain-Source Breakdown Voltage Gate-Source Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current V (BR)DSS V GS(th) I GSS I DSS -200 -1.5 -3.5 20 -10 -100 -300 28 50 V V nA A A mA mS I D =-1mA, V GS =0V I =-1mA, V DS = V GS
D
SYMBOL
MIN.
TYP.
MAX. UNIT CONDITIONS.
V GS =
20V, V DS =0V
V DS =-200 V, V GS =0 V DS =-160 V, V GS =0V, T=125C (2) V DS =-25 V, V GS =-10V VGS =-10V, I D =-150mA V DS =-25V,I D =-150mA
On-State Drain Current (1) Static Drain-Source On-State Resistance Forward Transconductance DYNAMIC Input Capacitance (2) Output Capacitance (2) Reverse Transfer Capacitance (2) SWITCHING Turn-On Delay Time (2) (3) Rise Time (2)(3) Turn-Off Delay Time (2) (3) Fall Time
(2)(3) (1)(2) (1)
I D(on) R DS(on) g fs
C iss C oss C rss
100 25 7
pF pF pF V DS =-25 V, V GS =0V, f=1MHz
t d(on) tr t d(off) tf
7 15 12 15
ns ns ns ns V DD =-25V, I D =-150mA
NOTES: (1) Measured under pulsed conditions. Width=300s. Duty cycle 2%. (2) Sample test. (3) Switching times measured with 50 source impedance and <5ns rise time on a pulse generator.
ISSUE 2 - SEPTEMBER 2006 3
ZXMP2120E5
TYPICAL CHARACTERISTICS
ISSUE 2 - SEPTEMBER 2006 4
ZXMP2120E5
CHARACTERISTICS
ISSUE 2 - SEPTEMBER 2006 5
ZXMP2120E5
PACKAGE OUTLINE PAD LAYOUT DETAILS
0.95 0.375 1.06 0.042 2.2 0.087
0.65 0.025
Controlling dimensions are in millimeters. Approximate conversions are given in inches
mm inches
PACKAGE DIMENSIONS
Millimeters DIM MIN. A A1 A2 b C D 0.90 0.90 0.20 0.09 2.70 MAX. 1.45 0.15 1.30 0.50 0.26 3.10 MIN. 0.0354 0.0354 0.0078 0.0035 0.1062 MAX. 0.0570 0.0059 0.0511 0.0196 0.0102 0.1220 E E1 e e1 L a Inches DIM MIN. 2.20 1.30 MAX. 3.20 1.80 MIN. 0.0866 0.0511 MAX. 0.1181 0.0708 Millimeters Inches
0.95 REF 1.90 REF 0.10 0 0.60 30
0.0374 REF 0.0748 REF 0.0039 0 0.0236 30
(c) Zetex Semiconductors plc 2006
Europe Zetex GmbH Kustermann-park Balanstrae 59 D-81541 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park Chadderton, Oldham, OL9 9LL United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com
These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com
ISSUE 2 - SEPTEMBER 2006 6


▲Up To Search▲   

 
Price & Availability of ZXMP2120E5

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X